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TSMC Q3 Earnings Review: 3nm Demand Beats as HPC Outgrows Smartphones for a Fourth Quarter

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Looking at the ASML earnings from the day before yesterday and the TSMC earnings from yesterday together is quite interesting. ASML grew revenue 30% this year on the back of mainland China DUV sales; TSMC barely held up with advanced nodes, with revenue down 10% this year; next year ASML growth may dip below 10%, while TSMC could see a rebound of 10%+; this divergence may be because logic recovers ahead of memory, or because logic recovery is stronger than memory.

TSMC Q3 Earnings:

  • Revenue was $17.28B in USD terms, down 15% year over year and up 10% sequentially, the third consecutive quarter of decline. In NTD terms, revenue was NT$546.73B, down 11% year over year and up 14% sequentially, the second consecutive quarter of decline.

  • Gross margin was 54.3%, down 6.1 percentage points year over year and 0.2 percentage points sequentially.

  • Operating income was $7.21B in USD terms, down 25% year over year and up 9% sequentially, for an operating margin of 42%.

  • Net income was $6.7B in USD terms, down 28% year over year and up 13% sequentially, for a net margin of 39%.

  • Equivalent 12-inch wafer shipments were 2,902K, down 27% year over year and 10% sequentially, the fourth consecutive quarter of decline; ASP was ~$5,954, up 17% year over year, the 15th consecutive quarter of year-over-year growth.

  • Capex was $7.1B in USD terms, down 19% year over year; full-year capex lowered to $32B, with 70% for advanced nodes, 20% for mature nodes, and 10% for advanced packaging and test.

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Looking specifically at process technology and platforms in Q3:

  • 3nm accounted for 6%, 5nm 37%, 7nm 16%, 16nm 12%, 20nm 1%, 28nm 10%, 40/45nm 6%, 65nm 6%, 90nm 1%, 0.11/0.13um 3%, 0.15/0.18um 4%, 0.25um+ 1%; advanced nodes (3nm/5nm/7nm) accounted for 59%.

    This quarter N5 growth came mainly from HPC and smartphone; HPC is AI, smartphone is seasonal; 7nm demand weakened more than expected, somewhat reminiscent of 28nm in its day; TSMC expressed confidence in filling 7nm and 6nm capacity through RF, connectivity chips and other specialty demand, returning to healthy utilization over the next few years.

  • HPC accounted for 42%, smartphone 39%, IoT 9%, auto 5%; HPC share exceeded smartphone for the 4th consecutive quarter. Smartphone up 33% sequentially on iPhone 15 launch; HPC up 6% sequentially; IoT up 24% sequentially; auto down 24% sequentially.

    Auto revenue declined in H2 this year due to inventory correction; TSMC expects a return to growth in 2024.

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Outlook:

  • Q4 revenue guided to $18.8-19.6B, down 2-6% year over year, slightly better than prior full-year guidance of a 10% decline; gross margin guided to 51.5-53.5%, operating margin to 39.5-41.5%.

  • Expect fabless inventory to approach healthy levels in Q4; PC and smartphone showing signs of recovery; believe TSMC will see healthy growth in 2024, but a sharp rebound is premature.

  • N3 demand exceeded expectations, continues to grow in Q4; this year revenue mix mid-single digits, higher next year; N3E volume production in Q4, followed by N3P, N3X iterations; N3P PPA comparable to Intel 18A, but earlier release and lower cost than peers.

  • Expect future smartphone growth to lag overall company growth; HPC will be the primary growth driver; backend business growth expected to slightly exceed overall company growth.

  • CoWoS capacity tight in the near term; target of 2x capacity increase next year unchanged, with expansion continuing through 2025. SoIC will start generating revenue next year and become one of the fastest-growing advanced packaging solutions over the next few years.

  • Expect capex growth to flatten over the next few years. This does not mean investment amounts will decrease, but capital intensity is expected to decline over the next few years.

  • N2 volume production in 2025; HPC backside-power N2 sampling in H2 2025, volume production in 2026.

  • Europe fab focused on auto/industrial 12/16/22/28nm, construction H2 2024, volume production 2027; US fab 4nm volume production H1 2025; Japan fab 12/16/22/28nm equipment move-in starting this month, volume production end of 2024; Nanjing fab expected to obtain permanent authorization.

  • Will not slow technology development; may slow capacity expansion based on customer demand.

Overall, TSMC remains very steady, once again confirming the semiconductor industry bottom; many tech stocks (including semiconductors) will begin to slowly recover in Q3. TSMC's better-than-expected N3 performance also confirms that advanced nodes are not lacking a market.

Originally published on the WeChat public account Eric有话说.